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Nexperia logo
安世半导体
Principal Manufacturing Engineer (Subcon, Backend / Assembly)
立即应聘

Principal Manufacturing Engineer (Subcon, Backend / Assembly)

发布于 大约 18 小时前

普通员工/个人贡献者

Hsinchu, Taiwan
高级经验
全职员工
仅现场办公
本科
生产制造
KPI
NPI
Problem Solving
Quality Management
Backend Manufacturing

AI 估算 · 25k–45k

Senior-level semiconductor engineer in Taiwan with 10+ years experience, competitive industry salary.

职位详情

关于这个职位

This role serves as the key technical interface between Nexperia and its outsourced semiconductor manufacturing partners (OSATs), ensuring stable, high-quality, and cost-efficient IC assembly operations. You will drive technical alignment, resolve production issues, and manage subcontractor performance in a high-volume/high-mix environment.

最低要求

Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field

+ years of experience in semiconductor assembly / wafer level / backend manufacturing
Strong experience in high-volume and high-mix production environments
Good understanding of semiconductor packaging processes and manufacturing flows
Project management experience in engineering or manufacturing environments
Strong analytical and problem-solving skills
Good communication and stakeholder management skills
Team player with strong collaboration mindset and ability to work with external partners

工作职责

Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)

Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
Monitor and manage subcontractor performance, including operational and quality KPIs
Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
Lead or support cost reduction and value engineering initiatives
Participate in audits (customer, quality, VDA) and support compliance verification activities
Support project milestones, technical reviews, and subcontractor performance reporting

AI 洞察

优缺点分析

优点

  • Work with cutting-edge semiconductor packaging technologies and global OSAT partners.
  • High visibility role with direct impact on product quality and cost efficiency.
  • Strong career stability in a leading semiconductor company with IPO backing.
  • Opportunity to develop deep technical and vendor management expertise.
  • High responsibility for external partner performance, requiring constant monitoring and escalation.
  • May involve frequent travel to subcontractor sites in different regions.
  • Fast-paced environment with tight production schedules and yield targets.
  • Experienced manufacturing engineers who enjoy technical leadership, cross-functional collaboration, and vendor management in the semiconductor industry.

缺点 / 挑战

暂无明显挑战项

角色解读

  • Advance to Senior Principal or Director level in manufacturing engineering or operations.
  • Move into broader supply chain or quality management roles.
  • Transition to internal manufacturing leadership or global process ownership.
  • Serve as the primary technical liaison between Nexperia and outsourced semiconductor assembly partners.
  • Review and approve process/material changes from subcontractors to ensure quality and reliability.
  • Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites.
  • Monitor subcontractor KPIs, support NPI, and lead cost reduction initiatives.
  • Deep expertise in semiconductor assembly/backend processes and high-volume manufacturing.
  • Strong project management and analytical problem-solving skills.
  • Excellent communication and stakeholder management for cross-company collaboration.
  • Ability to conduct audits and ensure compliance with quality standards (VDA, etc.).

申请策略

  • Tailor your resume to demonstrate both technical depth and stakeholder management.
  • Prepare to discuss specific examples of vendor performance improvement or cost savings.
  • Emphasize 10+ years of semiconductor assembly/backend experience with specific process knowledge.
  • Highlight project management achievements, e.g., leading NPI or cost reduction initiatives.
  • Showcase experience with subcontractor management, quality audits, and KPI monitoring.
  • Include examples of resolving complex production issues and improving yield.
  • Familiarize yourself with VDA audit standards and quality management systems.
  • Strengthen data analysis skills (e.g., statistical process control, yield analysis).

面试指南

  • Use STAR method (Situation, Task, Action, Result) for behavioral questions.
  • For technical questions, structure your answer around problem identification, root cause analysis, solution implementation, and verification.
  • Demonstrate cross-functional collaboration by highlighting communication with internal teams and external partners.
  • Describe a time you resolved a major yield issue at a subcontractor site.
  • How do you approach process change approvals from external partners?
  • Explain your experience with NPI and industrialization of new packages.
  • How do you balance cost reduction with quality requirements?
  • Tell us about a challenging audit you participated in and the outcome.

职位点评

61
综合评分

Senior IC assembly engineer role at a leading semiconductor company, offering strong pay and technical challenges but demanding frequent on-site presence.

更适合这类人
Candidates motivated by high compensation and technical depth in semiconductor manufacturing, who can tolerate on-site work and occasional travel.
表现最好
薪资福利
相对薄弱
工作生活
薪资福利75
成长发展70
工作生活40
使命价值60

薪资福利

75中等

The role offers competitive compensation typical for senior semiconductor engineers in Taiwan, with potential bonuses and benefits from a publicly listed company. Salary is above market average for the region.

薪资信号未披露(AI估算:25K-45K/月)

成长发展

70中等

The position provides opportunities to work with advanced packaging technologies and global partners, but growth into management roles may require additional steps. JD mentions support for NPI and cost reduction, indicating technical development.

技术前沿主流现代技术
技术栈semiconductor packaging、assembly、backend、wafer level、NPI、VDA
成长机会support NPI、lead cost reduction、project management
业务类型profit_center

工作生活

40较低

The role is site-based at subcontractor facilities, likely requiring frequent travel and on-site presence. No mention of remote work or flexible hours. Work-life balance may be challenging due to production pressures.

工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及(无法判断)

使命价值

60中等

Working in semiconductor manufacturing contributes to critical technology supply chains. The company's D&I statement and Paralympic partnership indicate some social responsibility, but the role itself is more operational.

行业发展稳定成熟行业
社会影响中性/一般
使命信号diversity and inclusion、equal-opportunity employer
创新程度稳健跟随主流
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© 2026 Watch Jobs. 保留所有权利

Created by jianglicat - 讲礼猫

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