For BSc candidate, 3+ years working experience in optomechanical products or semiconductor is preferred.
Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production.
Ability to influence cross-functional teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule.
Able to communicate and convey ideas clearly and concisely.
The applicant will also be familiar with at least 3 of the skills listed below:
Camera module or imaging system design and architecture, including optical components, optical sensing, and system integration.
Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
Electronic circuit and system design including power delivery, high-speed signal integrity, electrical integration of sensor interfaces.
Understanding of geometric optics and image quality evaluation, including test charts, algorithms, and lighting.
Image/depth sensor design or characterization.
Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
Failure analysis techniques including optical microscopy, X-ray, CT scans, SEM, etc.
Ability in root-cause and corrective-action analysis.
Proficiency in statistical analysis, data reporting, and visualization.
Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.