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IC Package Layout Engineer, Staff
IC Package Layout Engineer, Staff
发布于 大约 14 小时前普通员工/个人贡献者
Hsinchu City, Hsinchu City, Taiwan
专家级经验
全职员工
仅现场办公
本科
硬件工程
PCIe
DDR
SIP
Ic Packaging
Cadence Apd
2.5D/3D Interposer
Flip Chip Bga
Si/Pi Tools
AI 估算 · 30k–45k
Staff engineer at Qualcomm in Hsinchu; specialized packaging skills with high market demand, salary competitive in semiconductor
职位详情
关于这个职位
This role involves leading advanced IC package design and layout for Qualcomm's chips, focusing on package selection, physical design optimization, and collaboration with cross-functional teams to ensure electrical, mechanical, and thermal performance. You will work on cutting-edge packaging technologies like Flip chip BGA and 2.5D/3D interposers, driving innovation in design verification and automation. It's a technical individual contributor position for experienced engineers.
最低要求
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
工作职责
Own and drive advanced package selection, new generation product package structure, and configuration optimization.
Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.
Implement the physical design of packages and modules for SoC.
Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.
Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
Work multi-functionally to optimize package pin out.
Ensure package design is optimized with SI/PI requirements.
Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
Explore, evaluate, and develop new CAD tools, design, and verification flow.
Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.
优先资格
Bachelor's or Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
Experience with Calibre tool and package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
Solid understanding of Design Rules Check and Design for Manufacturing.
AI 洞察
优缺点分析
优点
- Work on cutting-edge semiconductor packaging technologies at a leading company like Qualcomm, gaining expertise in high-demand skills.
- Collaborate with multi-disciplinary teams, offering broad exposure to chip design, thermal, and electrical engineering.
- Competitive compensation and benefits typical of a large multinational corporation.
- Opportunity to drive innovation in design automation and methodology, enhancing your technical leadership.
- Highly technical role requiring deep knowledge of both packaging and electrical engineering, with steep learning curve.
- Tight project timelines and the need to coordinate with multiple teams can lead to high pressure.
- Constantly evolving technology landscape requires continuous learning to stay current with new packaging trends.
- This role is ideal for experienced IC package engineers who enjoy hands-on design, problem-solving, and working in a fast-paced, collaborative environment.
缺点 / 挑战
暂无明显挑战项
角色解读
- Advance to senior staff or principal engineer, leading larger package design projects and mentoring junior engineers.
- Transition into technical management roles, overseeing package design teams or cross-functional packaging projects.
- Deepen expertise in advanced packaging (e.g., 3D-IC, chiplets) and become a subject matter expert in the field.
- Lead the design and layout of advanced IC packages, selecting appropriate package structures and configurations for new products.
- Collaborate with cross-functional teams (electrical, mechanical, thermal) to optimize package performance for various chips.
- Drive design verification and automation improvements, developing new CAD tools and flows to streamline package release.
- Interface with vendors and internal teams to resolve design issues and innovate on packaging methodologies.
- Proficiency in Cadence APD/SiP and Allegro platform for package layout and design.
- Solid understanding of IC packaging structures, high-speed interfaces (DDR, PCIe), and SI/PI fundamentals.
- Experience with assembly/substrate technologies like Flip chip BGA and 2.5D/3D interposers.
- Knowledge of design rules, manufacturing processes, and tools like Calibre for design verification.
申请策略
- Tailor your resume to match the preferred qualifications, especially proven expertise in package design and high-speed interfaces.
- Research Qualcomm's packaging innovations and be ready to discuss how your experience aligns with their technology roadmap.
- Emphasize your experience with Cadence APD/SiP and Allegro, including specific projects and tape-out successes.
- Highlight familiarity with advanced packaging technologies (Flip chip, 2.5D/3D) and tools like Calibre, HFSS, or PowerSI.
- Showcase your ability to work cross-functionally and drive design improvements or automation initiatives.
- Quantify achievements, such as reducing package size, improving signal integrity, or streamlining design flows.
- If not already proficient, strengthen your knowledge of SI/PI simulation tools (e.g., Ansys HFSS, Cadence Sigrity).
- Learn about emerging packaging trends like 3D-IC, chiplets, and heterogeneous integration to stand out.
面试指南
- Use the STAR method (Situation, Task, Action, Result) for behavioral questions, focusing on technical contributions and collaboration.
- For technical questions, explain underlying principles, your specific approach, and outcomes achieved.
- Describe your experience with Cadence APD/SiP and how you've optimized package layout for signal integrity.
- How do you approach cross-functional collaboration to resolve package design challenges?
- Can you explain the trade-offs between different package types like Flip chip BGA vs. 2.5D interposer?
- What is your process for design rule checking and ensuring manufacturability?
- Describe a time you drove innovation or efficiency improvement in package design.
- Review your past projects in package design, especially those involving advanced substrates or high-speed interfaces.
职位点评
70
综合评分
Senior IC packaging role at Qualcomm, offering cutting-edge technology and growth, with limited flexibility and on-site requirement.
更适合这类人
This role is best suited for engineers who prioritize technical growth and innovation over work-life flexibility or strong social purpose.
表现最好
成长发展
相对薄弱
工作生活
薪资福利75
成长发展85
工作生活50
使命价值70
薪资福利
75中等
Qualcomm offers competitive salaries and benefits typical of a large semiconductor firm, though exact compensation is not specified in the JD. The role is a staff level, indicating good compensation potential.
薪资信号未披露（AI估算：30K-45K/月）
成长发展
85较高
This role provides strong growth opportunities through exposure to advanced packaging technologies, multi-functional collaboration, and ownership of design innovation. The JD mentions driving methodology and tool development, indicating a dynamic learning environment.
技术前沿前沿/新兴技术
技术栈Cadence APD、SiP、2.5D/3D Interposer、Flip chip BGA、SI/PI、Calibre
成长机会methodology、innovations、efficiency improvements
业务类型ambiguous
工作生活
50较低
The role is on-site in Hsinchu, with no mention of remote work or flexibility. Semiconductor packaging often requires lab presence, so flexibility is limited. Location in a tech hub may offer some lifestyle benefits.
工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及（无法判断）
使命价值
70中等
The role contributes to cutting-edge semiconductor technology that powers many modern devices, offering a sense of impact. However, no explicit social mission is stated, and the work is highly technical.
行业发展高速增长赛道
社会影响中性/一般
创新程度积极采用新技术
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