高通
Package/System Design Engineer (PMIC SIP and Module)
Package/System Design Engineer (PMIC SIP and Module)
发布于 大约 8 小时前普通员工/个人贡献者
Hsinchu City, Hsinchu City, Taiwan
中级经验
全职员工
仅现场办公
本科
硬件工程
SI/PI
PCB layout
Rf Design
Em Simulation
Power Distribution Network
Ic Package Design
System Level Co-Design
AI 估算 · 15k–30k
Based on mid-level hardware engineer role at a top semiconductor company in Hsinchu, Taiwan; competitive market rate.
职位详情
关于这个职位
As a Package/System Design Engineer at Qualcomm, you will be responsible for the architecture, design, and verification of IC packages for various products including digital, RF, analog, and PMIC. You will work on system-level co-design of IC, package, and PCB, focusing on electrical, thermal, and mechanical performance optimization. This role offers exposure to cutting-edge packaging technologies and high-speed design methodologies.
最低要求
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
+ years Hardware Engineering experience or related work experience.
工作职责
Experience in board level system design, schematic drawing, component selection, performance optimization and verification.
IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment
System level co-design methodology of IC, Package and PCB/Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk. And RF constraints for impedance matching, coupling, desense.
Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
优先资格
Experience in IC package and/or PCB selection, design, and layout experience
Experience in Pinmap optimization of optimal PCB design
Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
Working knowledge of die floor planning, IO placement, and bump placement
Working knowledge of Chip, Package and PCB co-design methodology
Familiar with assembly and substrate manufacturing process
Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with PCB stack-up and breakout strategy
AI 洞察
优缺点分析
优点
- Work at a global leader in semiconductor with cutting-edge packaging technology.
- Exposure to a wide range of IC products (digital, RF, analog, PMIC) enhancing versatility.
- Strong emphasis on innovation and methodology development, boosting technical depth.
- Collaborate with talented engineers across multiple disciplines.
- Requires deep knowledge in multiple domains (electrical, thermal, mechanical).
- High complexity in balancing performance, cost, and manufacturability.
- Fast-paced environment with tight project schedules.
- Engineers with a passion for hardware design and system-level optimization, who enjoy tackling multi-disciplinary challenges.
缺点 / 挑战
暂无明显挑战项
角色解读
- Advance to Senior Package Design Engineer leading complex package designs.
- Transition to technical lead or architect role driving next-generation packaging technology.
- Opportunity to move into cross-domain roles like system integration or product engineering.
- Own the end-to-end package design for Qualcomm's IC products, from concept to verification.
- Perform system-level co-design across IC, package, and PCB to optimize electrical, thermal, and mechanical performance.
- Define package design methodologies for high-speed signal integrity and power integrity.
- Collaborate with cross-functional teams (marketing, IC, product) for technology roadmapping and competitive analysis.
- Strong understanding of IC package design, including substrate, bump, and RDL.
- Proficiency in electromagnetic simulation tools (e.g., HFSS, CST) and SI/PI analysis.
- Knowledge of board-level system design and PCB layout techniques.
- Familiarity with assembly and substrate manufacturing processes.
申请策略
- Tailor your resume to emphasize package design projects and their impact on performance/cost.
- Research Qualcomm's recent package innovations and prepare to discuss how you can contribute.
- Showcase experience in IC package or PCB design with specific examples of SI/PI optimization.
- Highlight proficiency in EM simulation tools and knowledge of transmission line theory.
- Demonstrate experience in cross-functional collaboration and roadmapping.
- Include any publications or patents related to packaging technology.
- Deepen understanding of EM simulation tools (HFSS, CST) and PDN analysis.
- Learn about advanced packaging technologies like 2.5D/3D packaging and fan-out.
面试指南
- Use STAR method: Situation, Task, Action, Result to structure responses.
- When discussing technical problems, explain the problem, your analysis tools, and the final solution with measurable outcomes.
- For design trade-offs, present a structured comparison of options and justify your choice based on project priorities.
- How would you approach optimizing PDN for a high-frequency processor?
- Describe a time you resolved a signal integrity issue in a package design.
- What trade-offs do you consider when selecting a package type?
- Explain the co-design methodology between IC, package, and PCB.
- How do you stay updated with packaging technology trends?
职位点评
66
综合评分
Strong technical role in a top semiconductor company with high learning potential but limited flexibility.
更适合这类人
Candidates who prioritize technical skill development and are comfortable with on-site work.
表现最好
成长发展
相对薄弱
工作生活
薪资福利75
成长发展80
工作生活50
使命价值60
薪资福利
75中等
Qualcomm offers competitive compensation and benefits typical of a large multinational in the semiconductor industry. However, exact salary is not disclosed, and benefits are not specified in the JD, so the compensatory score is moderate-high.
薪资信号未披露（AI估算：15K-30K/月）
成长发展
80较高
The role involves advanced packaging technologies and high-speed design methodologies, offering strong technical growth. However, no explicit mention of training or promotion paths limits the score slightly.
技术前沿前沿/新兴技术
技术栈SI、PI、EM Simulation、PDN、RF、high-speed design
业务类型profit_center
工作生活
50较低
The work is on-site in Hsinchu, with no mention of flexible hours or remote work. The location is likely a tech hub, but without WLB signals, lifestyle score is average.
工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及（无法判断）
使命价值
60中等
Working at Qualcomm contributes to advancing mobile and IoT technology, which has broad societal impact. However, the JD focuses on technical details rather than mission, so score is moderate.
行业发展稳定成熟行业
社会影响中性/一般
创新程度积极采用新技术
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