高通
Package/System Design Solution Engineer, Senior
Package/System Design Solution Engineer, Senior
发布于 大约 8 小时前普通员工/个人贡献者
Hsinchu City, Hsinchu City, Taiwan
高级经验
全职员工
仅现场办公
本科
硬件工程
PCB
System Design
Em Simulation
3D/2D Em Simulation
Co-Design
Ic Packaging
Power Distribution Network
AI 估算 · 80k–120k
Senior level at Qualcomm Taiwan in semiconductor industry; market rate for advanced packaging engineers is competitive.
职位详情
关于这个职位
This senior engineer role at Qualcomm focuses on IC package and system design, including package selection, electrical modeling, and co-optimization of chip, package, and PCB. You will work on advanced packaging technologies for digital, RF, analog, and PMIC products, ensuring signal integrity and power delivery performance.
最低要求
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
工作职责
IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment
System level co-design methodology of IC, Package and PCB/Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk.
Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
优先资格
Experience in IC package and/or PCB selection, design, and layout experience - Experience in Pinmap optimization of optimal PCB design
Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
Working knowledge of die floor planning, IO placement, and bump placement
Working knowledge of Chip, Package and PCB co-design methodology
Familiar with assembly and substrate manufacturing process
Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with PCB stack-up and breakout strategy
AI 洞察
优缺点分析
优点
- Work on cutting-edge packaging technologies for world-leading mobile and IoT chips.
- Strong compensation and benefits from a top semiconductor company.
- Opportunity to collaborate with global experts and influence product roadmaps.
- High complexity and pressure to meet performance and cost targets.
- Requires deep cross-domain knowledge (IC, package, PCB) which can be demanding.
- Limited work-from-home flexibility as this is an on-site role.
- Engineers with a strong background in electrical engineering or mechanical engineering who enjoy hands-on design and simulation, and want to specialize in advanced semiconductor packaging.
缺点 / 挑战
暂无明显挑战项
角色解读
- Progress to lead engineer or technical expert in advanced packaging (e.g., 2.5D/3D, fan-out).
- Move into system architecture or product management roles within Qualcomm.
- Become a domain authority in signal integrity or power integrity for high-speed designs.
- Select and design IC packages (digital, RF, analog, PMIC) to meet mechanical, thermal, and electrical requirements.
- Perform electrical modeling and simulation for signal integrity and power distribution network.
- Collaborate with IC design, PCB, and marketing teams for system-level co-optimization and roadmapping.
- Strong understanding of electromagnetics, transmission line theory, and 3D/2D EM simulation tools.
- Experience in IC floorplanning, bump pattern design, and PCB breakout strategy.
- Knowledge of package assembly and substrate manufacturing processes.
申请策略
- Tailor your resume to include specific examples of package selection and co-design projects.
- Research Qualcomm's product lines (Snapdragon, RF360) to show genuine interest.
- Emphasize experience with IC package design, PCB layout, and EM simulation tools (HFSS, ADS, etc.).
- Highlight any projects involving signal integrity or power integrity analysis.
- Showcase cross-functional collaboration and understanding of system-level trade-offs.
- Strengthen knowledge of 3D/2D EM simulation and transmission line theory.
- Familiarize with substrate manufacturing processes and cost drivers.
- Learn about advanced packaging trends (2.5D, 3D, hybrid bonding).
面试指南
- Use STAR method (Situation, Task, Action, Result) for behavioral questions.
- For technical questions, first define the constraint (e.g., impedance target), then explain your analysis and optimization steps.
- Demonstrate system thinking by linking package design to overall product performance.
- Describe a challenging package design problem you solved.
- How do you approach signal integrity in high-speed interfaces?
- Explain the trade-offs between cost and performance in package selection.
- What simulation tools have you used for EM analysis?
- How do you coordinate with IC and PCB teams during co-design?
职位点评
74
综合评分
Senior packaging engineer role at Qualcomm Taiwan, offering cutting-edge technology and strong career development, but on-site with moderate work-life balance.
更适合这类人
Candidates who prioritize technical growth and compensation over flexible work arrangements.
表现最好
成长发展
相对薄弱
工作生活
薪资福利80
成长发展85
工作生活60
使命价值70
薪资福利
80较高
Qualcomm offers competitive salary, benefits, and job security in a stable industry. The Taiwan office provides good compensation relative to local market.
薪资信号市场水准 (80K-120K/月)
成长发展
85较高
The role involves cutting-edge packaging technology and strong technical growth opportunities. Qualcomm provides training and exposure to advanced design methodologies.
技术前沿前沿/新兴技术
技术栈3D/2D EM simulation、Signal Integrity、Power Distribution Network、Co-design
业务类型profit_center
工作生活
60中等
On-site role with limited flexibility, but located in Hsinchu Science Park which is a major tech hub. Work-life balance may vary depending on project deadlines.
工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及（无法判断）
使命价值
70中等
Semiconductor packaging is essential for advancing mobile and IoT technologies, contributing to global connectivity and computing progress.
行业发展高速增长赛道
社会影响中性/一般
创新程度积极采用新技术
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