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Cloud System Architect, Senior Staff
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Cloud System Architect, Senior Staff

发布于 大约 8 小时前

普通员工/个人贡献者

Taipei, Taipei City, Taiwan
专家级经验
全职员工
仅现场办公
本科
硬件工程
200/400/800 Gbe
Bmc
Ddr5
Liquid Cooling
Pcie Gen5/6
Smbus
Ddr4/5
Lpddr4X/5X
Rack-Level Design

AI 估算 · 50k–70k

Senior hardware role in AI data center, high demand in Taiwan, competitive but below US levels.

职位详情

关于这个职位

This is a senior hardware architect role at Qualcomm's Data Center System Hardware Engineering team. The position focuses on designing rack-level AI inference solutions for next-generation liquid-cooled data centers, including motherboards, add-in cards, and system/rack integration. You will collaborate with cross-functional teams and ODM partners to bring innovative AI hardware to market.

最低要求

Required Experience:

Minimum 15+ years in system/card/rack-level development, including architecture, design, validation, and deployment of enterprise-class hardware platforms.
Rack-Level Expertise:
Proven experience in rack-level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules.
Familiarity with rack-scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards.
Experience with rack-level diagnostics and bring-up, including debug of interconnects, signal integrity across long traces/cables, and system-level validation.
Understanding of rack-level mechanical constraints, EMI shielding, and compliance with data center deployment standards.
Collaboration with ODMs on rack-level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing.
Board-Level Design:
Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery.
Expertise in chassis design, airflow optimization, and thermal management.
Solid understanding of system software operation from bootloader to OS and application layers.
Component Qualification:
Experience qualifying PMICs, voltage regulators (VRs), clock buffers, flash memory, and connectors for use in complex card and rack-level designs.
Design & Validation:
Hands-on experience in dense, high-layer count PCB designs (8–20+ layers).
Skilled in PCIe add-in card/module design, debugging in high-performance systems (x86 and ARM).
Familiarity with JTAG tools for bring-up and debug.
Experience with networking switches and high speed ethernet interfaces
High-Speed Interfaces:
Knowledge of high-speed serial I/O (6–10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE.
Experience with long PCB/cable topologies (0.35–1.5 meter), signal integrity, and compliance with current standards.
Ability to debug at packet/protocol level across link, transport, transaction, and command layers.
Memory & Clocking:
Experience with LPDDR4x memory technologies, DIMM layout and validation.
Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration.
Tools & Collaboration:
Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition).
Experience with circuit simulation tools (SPICE), signal/power integrity analysis.
Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers.
Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines.
Firmware & Software:
Good understanding of x86 FW/SW stack and firmware architecture.
Experience with BMC hardware/software integration and management.
Compliance & Testing:
Familiarity with regulatory, environmental, and compliance testing for rack-level systems.
Networking and switch:
Familiarity with PCIE switch design/debug and test process
Familiarity with networking topology
Experience in Ethernet Switch hardware
Minimum Qualifications:
Bachelor’s degree in Electrical and Electronic Engineering, Computer Engineering, or related field.
+ years of hardware engineering experience or related work experience.
OR
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

工作职责

Develop system architecture, design reviews, component selections, mechanical and thermal designs, and test plans.

Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures.
Collaborate with internal teams and ODMs to develop and support customer-specific hardware and system requirements.
Facilitate consensus on technical trade-offs at hardware, software, design levels.
Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.
Participate in the design and development of rack-level inference solutions, ensuring alignment with customer requirements and system-level performance goals.
Resolve architecture and design issues across system, card, and rack levels.
Assist in the bring-up and debugging of hardware systems, cards, and rack-level configurations.
Provide technical oversight and manufacturing processes, ensuring quality and consistency across rack-level deployments.
Contribute to writing Statements of Work (SOWs) and ODM product requirements; drive technical milestones and deliverables.
Coordinate across multiple development sites, including Qualcomm locations and ODM/JDM partners in Taiwan and internationally.
Coordinate and deliver technical training for ODMs, with a focus on rack-level system integration and deployment.

AI 洞察

优缺点分析

优点

  • Work on cutting-edge AI inference solutions for liquid-cooled data centers, a rapidly growing field.
  • Be part of Qualcomm, a global leader in semiconductor technology, with access to world-class resources and talent.
  • Engage in complex system-level design spanning mechanical, thermal, electrical, and firmware domains.
  • Competitive compensation and opportunities for professional growth in a high-demand specialty.
  • Requires 15+ years of hardware engineering experience, making it a senior-level position with high expectations.
  • Involves frequent collaboration across global sites, which may require travel and time zone coordination.
  • Technical depth is demanding, covering everything from PCB layout to rack-scale systems and ODM manufacturing.
  • Potential for high-pressure deadlines typical in product development cycles.
  • This role is ideal for experienced hardware architects with a passion for AI infrastructure, large-scale system integration, and cross-functional leadership.

缺点 / 挑战

暂无明显挑战项

角色解读

  • Advance to principal architect or technical director in data center hardware, leading larger-scale system designs.
  • Opportunity to influence Qualcomm's AI infrastructure roadmap and contribute to next-gen liquid-cooled data centers.
  • Potential transition to technical leadership roles managing engineering teams or global projects.
  • Design and develop system architecture for AI server racks, including motherboards, add-in cards, and rack-level integration.
  • Collaborate with cross-functional teams (mechanical, thermal, signal integrity, validation) and ODM partners to deliver hardware from concept to production.
  • Lead system bring-up, debugging, and validation of hardware, resolving architecture and design issues across system, card, and rack levels.
  • Drive technical milestones, write SOWs, and coordinate across multiple development sites in Taiwan and internationally.
  • Deep expertise in high-speed interfaces (PCIe Gen5/6, DDR/LPDDR memory, 200/400/800 GbE) and signal integrity.
  • Strong knowledge of rack-level power delivery, thermal management, and mechanical integration for data center servers.
  • Proficiency with schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition) and lab equipment.
  • Experience collaborating with ODMs and managing joint designs, including manufacturing and compliance testing.

申请策略

  • Tailor your resume to demonstrate leadership in large-scale system design and your ability to resolve complex technical trade-offs.
  • Research Qualcomm's Data Center products and be prepared to discuss how your experience aligns with their AI roadmap.
  • Highlight your experience in rack-level integration projects, including chassis, backplane, and thermal management.
  • Emphasize your expertise in high-speed board design, especially PCIe, DDR, and signal integrity debugging.
  • Showcase your collaboration with ODM partners and ability to drive technical milestones from concept to production.
  • Include specific examples of bring-up and validation of complex hardware systems.
  • Familiarize yourself with liquid cooling technologies and data center deployment standards.
  • Brush up on PCIe Gen5/6 specifications and BMC firmware integration.

面试指南

  • For behavioral questions, use the STAR method: Situation, Task, Action, Result.
  • For technical questions, structure your answer by breaking down the problem, explaining your analysis, and presenting the solution with trade-offs considered.
  • Demonstrate your system-level thinking by connecting individual components to the overall rack architecture.
  • Describe a challenging rack-level thermal management problem you solved.
  • How do you debug signal integrity issues over long PCB traces or cables?
  • Explain your experience with PCIe switch design and debug.
  • How do you coordinate with ODM partners to ensure designs meet technical and schedule requirements?
  • What considerations are important when designing for liquid-cooled data centers?

职位点评

72
综合评分

Global chip leader, AI data center hardware architecture, cutting-edge technology, high compensation, but work-life balance may be challenging.

从薪资福利、成长空间、工作节奏和岗位方向综合评估，方便横向比较。

更适合这类人
This role is best suited for experienced engineers who prioritize technical innovation and career growth, and who are comfortable with on-site work and demanding schedules.
表现最好
成长发展
相对薄弱
工作生活
薪资福利72
成长发展88
工作生活48
使命价值76

薪资福利

72中等

The position offers competitive compensation typical of a global semiconductor leader, though specific salary details are not provided. Benefits are not explicitly listed in the job description.

薪资信号未披露（AI估算：50K-70K/月）

成长发展

88较高

This role provides exposure to leading-edge AI infrastructure technology, including liquid cooling and high-speed interfaces, offering significant technical growth and career advancement opportunities.

技术前沿前沿/新兴技术
技术栈PCIe Gen5/6、LPDDR5、DDR5、200/400/800 GbE、liquid cooling、BMC、SMBus、rack-level design
业务类型ambiguous

工作生活

48较低

The role requires on-site work in Taipei with no explicit work-life balance signals. The demanding nature of hardware development and global coordination may impact personal time.

工作模式仅现场办公
办公地点未明确
加班情况未提及（无法判断）

使命价值

76中等

The AI data center market is growing rapidly, giving this role a sense of purpose in advancing next-generation computing. However, the direct social impact is moderate.

行业发展高速增长赛道
社会影响中性/一般
创新程度积极采用新技术

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