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Nexperia logo
安世半导体
Principal Manufacturing Engineer (Subcon, Backend / Assembly)
立即应聘

Principal Manufacturing Engineer (Subcon, Backend / Assembly)

发布于 大约 8 小时前

普通员工/个人贡献者

Hsinchu, Taiwan
专家级经验
全职员工
仅现场办公
本科
生产制造
KPI
NPI
OSAT
Quality Management
Cost Reduction
Backend Manufacturing
Semiconductor Assembly
Vda Audit

AI 估算 · 35k–55k

Senior principal engineer in Taiwan semiconductor industry, 10+ years experience, market rate around 35000-55000 RMB/month.

职位详情

关于这个职位

This role serves as the technical interface between Nexperia and outsourced semiconductor assembly subcontractors, ensuring stable, high-quality, and cost-efficient IC assembly operations. The engineer drives technical alignment, resolves production issues, and manages subcontractor performance.

最低要求

Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field

+ years of experience in semiconductor assembly / wafer level / backend manufacturing
Strong experience in high-volume and high-mix production environments
Good understanding of semiconductor packaging processes and manufacturing flows
Project management experience in engineering or manufacturing environments
Strong analytical and problem-solving skills
Good communication and stakeholder management skills
Team player with strong collaboration mindset and ability to work with external partners

工作职责

Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)

Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
Monitor and manage subcontractor performance, including operational and quality KPIs
Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
Lead or support cost reduction and value engineering initiatives
Participate in audits (customer, quality, VDA) and support compliance verification activities
Support project milestones, technical reviews, and subcontractor performance reporting

AI 洞察

优缺点分析

优点

  • Work with leading semiconductor company on cutting-edge assembly technologies.
  • High level of responsibility and visibility in managing critical supply chain partners.
  • Competitive compensation and benefits in a stable industry.
  • Opportunity to develop deep technical expertise and project management skills.
  • Requires frequent travel or communication with subcontractors across different time zones.
  • High pressure to resolve production issues quickly to avoid revenue impact.
  • Demands continuous learning of new packaging technologies and processes.
  • Ideal for experienced semiconductor engineers who enjoy hands-on technical problem-solving and cross-organizational collaboration.

缺点 / 挑战

暂无明显挑战项

角色解读

  • Advance to Senior Principal Engineer or Manager of Manufacturing Engineering.
  • Transition to technical leadership roles in OSAT management or global supply chain.
  • Opportunity to move into broader engineering management or director-level positions.
  • Act as the technical bridge between Nexperia and outsourced assembly subcontractors, ensuring processes meet quality and reliability standards.
  • Review and approve process or material changes from subcontractors to maintain manufacturing stability.
  • Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites.
  • Monitor subcontractor performance via KPIs and support cost reduction initiatives.
  • Deep knowledge of semiconductor assembly processes, packaging, and high-volume manufacturing.
  • Strong project management skills to handle NPI and process changes.
  • Excellent analytical and problem-solving abilities for yield and quality issues.
  • Communication and stakeholder management to coordinate with external partners.

申请策略

  • Tailor your resume to match the specific subcontractor management and technical gatekeeper role.
  • Be prepared to discuss examples of how you resolved complex production issues or drove cost reduction.
  • Emphasize 10+ years in semiconductor assembly and backend manufacturing.
  • Highlight specific experience with OSAT management, NPI, and yield improvement.
  • Showcase project management achievements and KPI-driven performance improvements.
  • Include any experience with audits (VDA, customer) and compliance.
  • Refresh knowledge of advanced packaging technologies like fan-out, SiP, and 3D stacking.
  • Strengthen data analysis skills using tools like JMP or Minitab for yield analysis.

面试指南

  • Use the STAR method (Situation, Task, Action, Result) for behavioral questions.
  • For technical questions, structure your answer with problem definition, root cause analysis, solution implementation, and outcome.
  • Demonstrate cross-functional collaboration and data-driven decision making.
  • Describe a time you managed a critical quality issue at a subcontractor site.
  • How do you evaluate and approve process changes from external partners?
  • Explain your approach to driving yield improvement in a high-volume manufacturing environment.
  • How do you balance cost reduction goals with maintaining quality and reliability?
  • Tell me about a project where you led NPI for a new package type.

职位点评

71
综合评分

Senior technical role with strong developmental opportunities, good compensation, but typical semiconductor on-site demands.

更适合这类人
Best suited for engineers prioritizing technical growth and expertise in semiconductor manufacturing.
表现最好
成长发展
相对薄弱
工作生活
薪资福利75
成长发展80
工作生活60
使命价值70

薪资福利

75中等

The position offers competitive compensation typical for senior engineering roles in Taiwan's semiconductor industry, with a stable company and benefits. However, exact salary is not disclosed in JD.

薪资信号未披露(AI估算:35K-55K/月)

成长发展

80较高

The role provides strong technical growth in advanced semiconductor assembly processes and project management, with exposure to NPI and cost reduction. Promotion not explicitly mentioned but implied by senior level.

技术前沿主流现代技术
技术栈semiconductor assembly、packaging、NPI、yield improvement、VDA audit
业务类型profit_center

工作生活

60中等

Work mode is on-site at subcontractor facilities in Hsinchu, with potential travel. No explicit WLB signals in JD, and semiconductor industry can be demanding.

工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及(无法判断)

使命价值

70中等

Semiconductor industry is stable and growing, but the role focuses on manufacturing efficiency rather than direct societal impact. Company emphasizes D&I but no mission signals in JD.

行业发展稳定成熟行业
社会影响中性/一般
创新程度积极采用新技术
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我们专注于实时追踪各企业最新职位动态,帮助您节省求职时间,快速找到理想工作机会。

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© 2026 Watch Jobs. 保留所有权利

Created by jianglicat - 讲礼猫

安世半导体 的其他在招职位

  • Business Product Manager

    安世半导体 · Taipei, Taiwan
    AI 估算 · 22k-38k
  • Principal Manufacturing Engineer (Subcon, Backend / Assembly)

    安世半导体 · Hsinchu, Taiwan
    AI 估算 · 25k-45k
  • Foundry Quality Manager

    安世半导体 · Hsinchu, Taiwan
    AI 估算 · 25k-45k
  • FE Sourcing Manager

    安世半导体 · Hsinchu, Taiwan
    AI 估算 · 50k-80k
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    AI 估算 · 15k-25k

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