Dir, Package Design Engineering
发布于 大约 15 小时前中层管理(经理/总监)
AI 估算 · 45k–70k
Senior director level in semiconductor packaging, Taiwan market. High experience requirement and specialized skills command prem
职位详情
关于这个职位
This role is a senior leadership position in semiconductor package design engineering. You will lead assembly engineering teams in Japan and Malaysia, manage OSAT relationships, and drive yield, cost, and cycle time improvements. It requires deep technical expertise in various package types and strong cross-functional collaboration with NPI, SCM, and QA teams.
最低要求
+ year Assembly Engineering experience
工作职责
Responsible for Japan Assembly Engineering (PAE1) and Malaysia Assembly Engineering (PAE3) Groups.
AI 洞察
优缺点分析
优点
- High impact role at a leading semiconductor company with global reach.
- Opportunity to work on cutting-edge packaging technologies for automotive and IoT.
- Strong compensation and benefits package typical for senior leadership.
- Culture of innovation and continuous improvement (TAGIE).
- Requires extensive experience (15+ years) and deep technical knowledge, limiting applicant pool.
- Global team management across Japan and Malaysia may involve travel and time zone challenges.
- Fast-paced industry with demanding yield and cost targets.
- Experienced engineering leaders with a strong background in semiconductor assembly and OSAT management, seeking a senior role with strategic influence.
缺点 / 挑战
暂无明显挑战项
角色解读
- Advance to higher executive roles such as VP of Packaging or Global Operations.
- Expand influence into broader R&D or strategic planning within the semiconductor industry.
- Opportunity to lead larger global teams and drive technology roadmaps.
- Lead two assembly engineering groups (Japan and Malaysia), overseeing daily operations and strategic initiatives.
- Collaborate with package development NPI team to transition new products into mass production.
- Manage OSAT relationships, resolve quality issues, and define outsourcing strategy.
- Deep expertise in multiple package types (FCCSP, FCBGA, QFN, etc.) and substrate technologies.
- Strong OSAT management and supply chain coordination abilities.
- Proven experience in automotive packaging and industry standards (JEDEC, IPC).
- Excellent cross-functional communication and project management skills.
申请策略
- Align your application with Renesas' purpose 'To Make Our Lives Easier' and TAGIE culture.
- Prepare to discuss specific examples of OSAT strategy definition and competitive benchmarking.
- Emphasize 15+ years of assembly engineering experience with specific package types and OSAT management.
- Highlight automotive packaging experience and familiarity with industry standards (JEDEC, IPC).
- Showcase leadership of global teams and cross-functional collaboration results.
- Quantify achievements in yield improvement, cost reduction, and cycle time reduction.
- Deepen knowledge of advanced packaging like 2.5D/3D and heterogeneous integration.
- Strengthen supply chain and procurement strategy skills.
面试指南
- Use STAR method (Situation, Task, Action, Result) for behavioral questions.
- Demonstrate strategic thinking by linking technical decisions to business outcomes.
- Show leadership by emphasizing team development and cross-site collaboration.
- How do you manage yield improvement across multiple assembly sites?
- Describe a time you resolved a critical supply chain issue with an OSAT.
- What experience do you have with automotive packaging qualifications?
- How would you drive cost reduction while maintaining quality?
- Tell us about a successful technology transfer from NPI to mass production.
职位点评
Senior director role in semiconductor packaging, strong compensation, global scope, but demanding on-site presence and travel.
从薪资福利、成长空间、工作节奏和岗位方向综合评估，方便横向比较。
薪资福利
Senior director role at a global semiconductor company with competitive compensation. Benefits package mentioned, but specific numbers not disclosed. Likely strong total rewards.
成长发展
The role offers exposure to advanced packaging technologies and cross-functional leadership, but the focus is on existing operations rather than frontier R&D. Growth paths exist but are not explicitly described in the JD.
工作生活
On-site work required, likely in Taichung. No mention of flexibility. Senior role may involve frequent travel between Japan and Malaysia, impacting work-life balance.
使命价值
Renesas' purpose 'To Make Our Lives Easier' and focus on automotive, industrial, and IoT contribute to societal impact. However, the role is more operational than directly mission-driven.
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