Cross-BU Commonality – Work closely with ANZ, EA, PDSS, and CPS to align and sync the commonality of POD and support differentiated design reviews across regional variants.
Common Module Customization & BU Alignment – Drive common module customization and secure alignment with relevant BUs / Divisions on scope, specifications, and release cadence. Module Competitiveness – Develop and maintain common module competitiveness with GPL / BU support, benchmarking cost, lead time, and performance against competitors. POD Product Definition – Maintain the APAC IEC POD product definition aligned with NVIDIA DSX Block 2 deployment requirements and Eaton's MV-to-rack reference architecture (10kV AC → 400V AC today; 22/11kV AC → 800V DC future). Customer Technical Engagement – Support key Hyperscale and MTDC customer engagements (Firmus, NextDC, DayOne, etc.) who want IEC design, contributing to IEC version requirement reviews and design optimization workshops. Sales Enablement – Partner with Regional KAM, BDM, and AE to engage customers, define project scope, and convert opportunities into standardized POD deployments. Peer Collaboration – Collaborate closely within the regional solution architecture team to ensure product definition, reference design, and supplier integration strategy stay synchronized. JV & Segment Coordination – Coordinate with Yineng JV, Transformer JV, CPC, and Segment teams to ensure POD scope, interface alignment, and go-to-market are integrated end-to-end. Lifecycle Support – Support PLM milestones, design change tracking, and post-launch performance monitoring (win rate, margin, lead time).