博通
Substrate Engineer
Substrate Engineer
发布于 大约 3 小时前普通员工/个人贡献者
Taiwan-Hsinchu-Puding Road
高级经验
全职员工
仅现场办公
本科
硬件工程
NPI
Cross-Functional Collaboration
Problem Solving
Cost Reduction
Abf Substrate
Ball Grid Arrays
Flipchip
Ic Substrate
Packaging Technology
AI 估算 · 30k–50k
Senior substrate engineer at Broadcom Taiwan; competitive pay for deep expertise; limited to local market.
职位详情
关于这个职位
This role focuses on managing IC substrate subcontractors for high-volume semiconductor devices, driving NPI activities, process improvements, and cost reduction. You will collaborate with cross-functional teams to resolve packaging, manufacturing, and quality issues, and support production engineering. It requires deep expertise in substrate technologies and strong problem-solving skills.
最低要求
Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
years' experience in IC substrate manufacturing technologies and processes.
Direct process and operational experience in a substrate manufacturing operations line is required.
Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
Direct process and operational experience in manufacturing environment.
Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues.
Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
Thorough knowledge of problem solving methodologies and failure analysis techniques.
Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations.
Demonstrate good communication skills in problem resolution.
Have a very good command on spoken and written English, Fluent in Mandarin.
Willing to travel throughout Asia to support manufacturing locations.
工作职责
Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity.
Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements.
Drive capability enhancement and cost reduction projects.
优先资格
Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable.
AI 洞察
优缺点分析
优点
- Work for a top semiconductor company (Broadcom) with stable business and advanced technology.
- Gain deep expertise in IC substrate technology, critical for modern chips.
- Opportunity to travel across Asia and interact with global manufacturing sites.
- High compensation potential due to specialized skills.
- Requires extensive travel (up to 30-40%), which may impact work-life balance.
- High pressure from managing yield and quality issues in high-volume production.
- Need to handle complex technical problems across multiple cross-functional teams.
- Experienced semiconductor engineers with strong substrate background who enjoy technical challenges and global collaboration.
缺点 / 挑战
暂无明显挑战项
角色解读
- Technical career path: Become a subject matter expert in advanced packaging (e.g., 2.5D/3D, HBM integration).
- Management path: Lead a team of substrate engineers or transition into a packaging program manager role.
- Cross-domain: Move into broader semiconductor manufacturing, supply chain, or quality engineering.
- Manage relationships with IC substrate subcontractors to resolve manufacturing, yield, and quality issues.
- Drive NPI activities and process improvements for high-volume semiconductor packaging.
- Collaborate with cross-functional teams (design, quality, operations) to optimize packaging technologies.
- Standardize best-known methods across sites and ensure compliance with Broadcom requirements.
- Deep knowledge of IC substrate manufacturing processes, especially ABF and laminate substrates.
- Strong problem-solving and failure analysis skills (8D, root cause analysis).
- Effective communication in English and Mandarin to coordinate with global teams and suppliers.
- Project management experience to drive complex activities across multiple groups.
申请策略
- Tailor your resume to highlight substrate-specific technical specs and problem-solving examples.
- Prepare to discuss a specific yield or quality issue you resolved in a previous role.
- Emphasize direct experience in IC substrate manufacturing (ABF, laminate, assembly processes).
- Quantify achievements in yield improvement, cost reduction, or new product introduction.
- Showcase cross-functional project leadership and collaboration with subcontractors.
- Include fluency in Mandarin and English as a key differentiator.
- Familiarize with advanced packaging technologies like 2.5D/3D, HBM, or fan-out wafer-level packaging.
- Strengthen statistical process control (SPC) and design of experiments (DOE) skills.
面试指南
- Use STAR method: Situation, Task, Action, Result. For technical questions, explain the problem, your analysis (e.g., FA techniques), the solution implemented, and quantifiable outcomes. For behavioral questions, emphasize collaboration, leadership, and data-driven decision making.
- Describe your experience with IC substrate manufacturing processes. What types of substrates have you worked on?
- Tell me about a time you improved yield or reduced cost in a substrate manufacturing line.
- How do you manage a conflict between a subcontractor's capability and Broadcom's quality requirements?
- Explain the interaction between ABF substrate and flipchip assembly, and common failure modes.
- Give an example of leading a cross-functional team to resolve a complex manufacturing issue.
- Review key substrate technologies: ABF, BT, die attach materials, and assembly processes (wirebond, flipchip).
- Prepare 2-3 detailed project examples with metrics (yield improvement %, cost savings).
职位点评
61
综合评分
Senior substrate engineer at Broadcom: deep technical challenges, strong compensation potential, but requires significant travel and on-site presence.
更适合这类人
This role is best for engineers who prioritize technical depth and career growth over work-life balance, and are comfortable with frequent travel.
表现最好
成长发展
相对薄弱
工作生活
薪资福利60
成长发展75
工作生活45
使命价值65
薪资福利
60中等
Compensation is likely competitive for the senior level in Taiwan, but the JD does not disclose salary or benefits explicitly, limiting visibility.
薪资信号未披露（AI估算：30K-50K/月）
成长发展
75中等
The role offers deep technical growth in advanced packaging and opportunities to lead process improvements, but no explicit training or promotion path is mentioned.
技术前沿主流现代技术
技术栈IC Substrate、ABF Substrate、Ball Grid Arrays、Flipchip、Wirebonding、Molding、NPI、Yield Improvement
业务类型ambiguous
工作生活
45较低
The job requires willingness to travel throughout Asia, and no work-from-home or flexible hours are mentioned. On-site presence is expected.
工作模式仅现场办公
办公地点科技园/产业园
加班情况未提及（无法判断）
使命价值
65中等
Semiconductor industry is stable and technology-driven; the role contributes to high-volume production of critical components, but no explicit social mission is stated.
行业发展稳定成熟行业
社会影响中性/一般
创新程度积极采用新技术
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