OSAT Execution Program Manager
发布于 3 天前中层管理(经理/总监)
值不值得投
综合评分 74
Senior PM in advanced semiconductor packaging at a major chipmaker, offering high technical development but with unknown WLB and undisclosed salary.
从薪资福利、成长空间、工作节奏和岗位方向综合评估，方便横向比较。
薪资怎么样
35K
比项目与项目集管理中位数高
发布情况
新岗位 · 3 天前发布
公司情况
这家公司招聘很活跃
约 100 个在招
市场机会
选择面较广
项目与项目集管理 · 约 1720 个在招
职位详情
关于这个职位
This role is for an OSAT Execution Program Manager within AMD's Heterogeneous Integration Technology organization. You will be responsible for coordinating and supporting the execution of semiconductor engineering builds, New Product Introduction (NPI) activities, and ramp-up readiness with OSAT (Outsourced Assembly and Test) partners and foundries. This involves managing schedules, tracking tooling capacity, identifying risks, and driving cross-functional alignment to ensure product milestones are met.
最低要求
Experience in semiconductor packaging, OSAT operations, NPI execution, manufacturing readiness, or related program management functions. Ability to manage cross-functional action items, track schedules, and drive accountability across engineering, operations, and supplier teams. Working knowledge of engineering builds, design tapeout milestones, failure analysis processes, tooling readiness, and capacity planning. Ability to identify execution risks, assess schedule impact, and develop recovery plans with clear escalation paths. Strong communication, organization, and reporting skills, with experience developing dashboards, templates, and executive-ready status updates. Demonstrated capability to work with external suppliers and internal engineering teams to resolve delays, readiness gaps, and process alignment issues. Proficiency in standard project tools like MS Office, MS Project, MS SharePoint. A proven history of collaborative success at all organizational levels.
工作职责
Meeting Coordination and Action Item Tracking: Coordinate weekly OSAT meetings, capture and maintain action items, and proactively track owners, due dates, and closure status ahead of key milestones. Test Vehicle, NPI, and Ramp Execution Support: Review engineering build plans, track design tapeout schedules, assess program schedule impact, consolidate failure analysis requests, and support recovery plans and escalation paths when execution risks arise. Tooling List Management and Capacity Readiness: Track toolset availability, qualified equipment status, long lead-time tools, and capacity bottleneck tools to ensure readiness for engineering builds, NPI, and ramp execution. Risk Identification and Escalation: Highlight schedule, tooling, capacity, and supplier risks when they impact product timelines, and drive timely escalation with clear mitigation and recovery actions. Reporting Standardization: Create, consolidate, and maintain OSAT dashboards to provide consistent visibility into execution status, risks, actions, and readiness metrics. Template and Process Alignment: Standardize FAI and process buyoff templates across OSAT engagements to improve consistency, efficiency, and cross-functional alignment. Supplier Manufacturing Readiness Support: Track SMR progress at OSATs, work with suppliers to justify delays, and coordinate with engineering teams to drive issue resolution and schedule recovery.
优先资格
BS or MS in Supply Chain, Industrial engineering, Operations or Business is preferred.
AI 洞察
优缺点分析
优点
- 能够深度参与半导体先进封装和异构集成等前沿技术产品的执行落地，技术视野开阔
- 作为AMD这样的行业领导者，平台大，能接触到全球顶尖的供应商和合作网络
- 岗位核心是协调与推动，对个人跨职能领导力、沟通力和项目把控力的提升非常显著
- 工作内容直接关系到产品能否按时高质量上市，成就感和影响力强
- 需要同时管理内部多个团队和外部多个供应商，协调难度和沟通成本极高
- This role is best suited for an experienced program manager who thrives in complex, technical environments, enjoys building bridges between diverse teams, and is motivated by driving tangible execution results in the semiconductor industry.
缺点 / 挑战
- 项目执行节奏快，需持续跟踪大量细节（如工具、时间表、风险），对细致度和抗压能力要求高
- 当出现风险时，需要快速分析并推动升级和制定恢复计划，对决策速度和应变能力是考验
角色解读
- 可向更高级别的项目总监或运营负责人发展，管理更复杂的跨区域、跨技术项目组合
- 凭借深入的半导体封装和供应链知识，可转向供应链管理、运营策略或技术战略等相关领域
- 在公司内部成为异构集成或先进封装领域的关键协调者，参与下一代技术路线的规划
- 协调和支持与外部OSAT及代工厂的工程构建、新产品导入和产能爬坡执行
- 管理项目时间表，跟踪工具设备就绪状态，并主动识别与上报执行风险
- 推动跨职能团队（工程、运营、供应商）之间的沟通与问责，确保项目里程碑达成
- 维护项目仪表盘和流程模板，以提升执行状态的可视化和流程一致性
- 半导体封装、OSAT运营或制造就绪等领域的项目管理经验
- 强大的跨职能协调、沟通和问题解决能力，能够推动多方团队达成目标
- 对工程构建、设计流片、失效分析、工具就绪和产能规划有实际了解
- 熟练使用MS Project、SharePoint等项目管理工具进行跟踪和汇报
申请策略
- 研究AMD在异构集成和先进封装方面的最新公开技术文章或新闻，了解其技术战略方向，这能体现您的热情和准备度
- 在简历和面试中，强调您“项目驱动”的思维方式，以及如何主动管理风险而非被动响应
- 详细描述您管理过的、涉及OSAT或外部代工厂的复杂项目案例，突出您如何协调多方、管控时间线并解决突发问题
- 使用量化数据体现您的成果，例如：提前交付率、风险识别数量、流程改进带来的效率提升百分比等
- 重点列出您熟悉的半导体相关术语和流程，如NPI、Tapeout、SMR、FAI、封装类型（如2.5D/3D, Chiplet）等
- 突出您的跨职能沟通经验，特别是与工程、运营和供应商团队协作的具体事例
- 复习和加深对先进半导体封装技术（如异构集成、Chiplet）的了解，以便更好地理解项目技术背景
- 熟练掌握至少一种高级项目管理或数据分析工具（如Power BI、Jira），以强化数据驱动决策的能力
面试指南
- 使用STAR（情境、任务、行动、结果）结构来回答行为问题，确保答案具体、有逻辑
- 回答时体现你的结构化思维，例如：先分析风险根源，再制定恢复计划（短期应对和长期预防），最后是沟通与升级
- 展示你的沟通策略：如何根据受众调整汇报内容（给工程师讲细节，给高层讲影响和决策选项）
- 请描述一个你管理过的涉及外部供应商（如OSAT/代工厂）的复杂项目，你遇到了最大的执行风险是什么，你是如何解决的？
- 你如何建立和管理一个项目仪表盘，以向不同层级的干系人（团队、经理、高层）汇报进展？
- 当你的项目时间表因为内部工程团队的延迟而受到严重影响时，你会采取哪些步骤来恢复进度？
- 请分享一个你成功推动跨职能团队（如工程与运营）达成一致并解决流程对齐问题的例子
- 你如何确保你的OSAT合作伙伴为即将到来的工程构建或产能爬坡做好了制造准备？
职位点评
薪资福利
This is a senior role in a multinational technology company, likely offering competitive compensation. However, the specific salary details are not disclosed in the JD, so the actual financial reward cannot be fully verified.
成长发展
This role offers significant development opportunities by placing the candidate at the heart of next-generation semiconductor technology execution, involving cutting-edge heterogeneous integration and cross-functional leadership.
工作生活
The work location is explicitly stated as Hsinchu, Taiwan. The JD does not mention remote or hybrid work options, suggesting a primarily on-site presence. No specific work-life balance signals are provided.
使命价值
The position contributes to developing advanced semiconductor technologies aimed at solving global challenges in AI and computing, which aligns with a strong sense of purpose and industry impact.
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