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DSP Core Design Engineer, Principal

DSP Core Design Engineer, Principal

发布于 大约 8 小时前

普通员工/个人贡献者

Hsinchu City, Taiwan
专家级经验
全职员工
仅现场办公
本科
芯片设计
Asic
Cpu微架构
Dsp
Rtl
低功耗设计
性能优化
多线程处理器

AI 估算 · 60k–100k

资深芯片设计岗,技术壁垒高,高通平台竞争力强,台湾地区高薪产业,薪资处于行业高位

职位详情

关于这个职位

该职位是高通ASICS工程部门的资深DSP核心设计工程师(Principal级别),位于新竹,负责Hexagon DSP核的微架构与RTL开发,参与低功耗、高性能多线程处理器设计

你将与全球团队合作,推动创新并解决复杂技术难题,适合有深厚CPU/DSP设计经验的专家

最低要求

工程、科学或相关领域的学士学位,并具有8年以上的ASIC设计、验证、集成或相关工作经历

工程、科学或相关领域的硕士学位,并具有7年以上的ASIC设计、验证、集成或相关工作经历
工程、科学或相关领域的博士学位,并具有6年以上的ASIC设计、验证、集成或相关工作经历

工作职责

负责Hexagon核的微架构和RTL开发,包括低功耗优化、性能探索,满足面积和时序目标

推动指令集、RTOS、软件架构、微架构、功耗、散热以及解决di/dt问题方面的创新
参与高性能、多线程、低功耗核心的设计,支撑移动、服务器、IoT、汽车等应用

AI 洞察

优缺点分析

优点

  • Work at the world's leading wireless technology company with massive scale (20B+ cores shipped).
  • High technical challenges with modern CPU/DSP design, valuable for career growth.
  • Competitive compensation and benefits typical of top semiconductor firms.
  • Exposure to a wide range of applications (mobile, IoT, automotive) and cross-functional teams.
  • High complexity and pressure to meet performance and power goals.
  • May require long hours and flexibility, typical in chip design.
  • Location in Hsinchu, Taiwan, which may require relocation for some candidates.
  • This role is ideal for experienced CPU/DSP architects who are passionate about low-level microarchitecture and want to work on mainstream processor IP.

缺点 / 挑战

暂无明显挑战项

角色解读

  • As a Principal Engineer, you can advance to Senior Principal/Architect level, or move into technical leadership roles.
  • Opportunity to become a subject-matter expert in Hexagon architectures and influence next-gen product roadmaps.
  • Potential to transition to systems architecture or SoC integration roles across Qualcomm's product lines.
  • Design and develop microarchitecture and RTL for high-performance Hexagon DSP cores.
  • Focus on low-power optimizations, performance exploration, and meeting area and timing targets.
  • Drive innovation in instruction set, RTOS, software architecture, microarchitecture, power, thermal, and di/dt issues.
  • Collaborate with cross-functional teams to deliver cutting-edge processor IP for mobile, IoT, automotive, and server markets.
  • Strong CPU microarchitecture knowledge including pipelines, out-of-order design, load/store units, caches, and memory hierarchy.
  • Proficiency in RTL design (Verilog/SystemVerilog) and ASIC implementation flow.
  • Experience with low-power design techniques and performance/power trade-offs.
  • Familiarity with ARM or RISC-V architectures
  • plus experience with DSP or vector processors.

申请策略

  • Tailor your resume to highlight principal-level ownership and impact.
  • Prepare to discuss how you solved challenging microarchitecture problems in previous roles.
  • Highlight your experience in microprocessor design, especially pipeline, cache, and memory subsystems.
  • Showcase specific projects where you owned RTL development and achieved power/performance improvements.
  • Demonstrate expertise in low-power design and familiarity with ARM/RISC-V.
  • Emphasize collaboration in a cross-functional environment.
  • Review advanced CPU architecture concepts, including out-of-order execution, speculation, and cache coherence.
  • Familiarize yourself with Qualcomm's Hexagon architecture and DSP-specific optimizations.

面试指南

  • Structure answers around design goals (performance, power, area) and use concrete examples from your experience.
  • Start with high-level approach, then dive into specific details, showing systematic problem-solving.
  • Mention collaboration and decision-making process to show ownership.
  • Explain the trade-offs between performance, power, and area in a processor design.
  • Describe how you would optimize a load/store unit for a high-performance DSP core.
  • What are the key challenges in designing a multi-threaded, low-power core?
  • How do you handle clock domain crossing or power management in RTL?
  • Prepare detailed examples of your past microarchitecture or RTL projects with measurable results.

职位点评

76
综合评分

Principal-level DSP core design at Qualcomm with strong technical challenge and pay, but uncertain WLB and location in Taiwan.

从薪资福利、成长空间、工作节奏和岗位方向综合评估,方便横向比较。

更适合这类人
This role suits experienced CPU/DSP engineers who prioritize technical mastery and career advancement and are comfortable with an intense, on-site work environment.
表现最好
成长发展
相对薄弱
工作生活
薪资福利80
成长发展88
工作生活55
使命价值75

薪资福利

80较高

Qualcomm is a top-tier semiconductor company, and principal-level roles typically command premium salaries. Although no explicit numbers are provided, the compensation is expected to be competitive, with good benefits.

薪资信号未披露(AI估算:60K-100K/月)

成长发展

88较高

This role offers deep engagement with cutting-edge CPU/DSP microarchitecture and RTL design, providing strong technical growth and learning opportunities.

技术前沿主流现代技术
技术栈CPU微架构、RTL、低功耗、Hexagon、DSP、ASIC、流水线、多线程
业务类型ambiguous

工作生活

55较低

The work site is in Hsinchu, Taiwan, and no flexible/remote options are mentioned. Chip design roles often imply intense schedules, and WLB is uncertain.

工作模式未明确
办公地点未明确
加班情况未提及(无法判断)

使命价值

75中等

Qualcomm's Hexagon cores power billions of devices, giving a strong sense of impact, though the role is technical rather than directly mission-driven.

行业发展稳定成熟行业
社会影响中性/一般
创新程度积极采用新技术
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